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1 publication date: august 2010 ver. aeb data sheet part no. package code no. AN41402A ubga022-w-2030aea
AN41402A 2 ver. aeb contents ? overview ????????????????????.????????????????????? 3 ? features ???????????????????.?????????????????????? 3 ? applications ???????????????????.????????????????????? 3 ? package ???????????????????.??????????????????????. 3 ? type ?????????????????????.??????????????????????. 3 ? application circuit example (block diagram) ?????????????????????????? 4 ? pin descriptions ????????????????.?????????????????????? 5 ? pin configuration ?????????????????????????????????????? 5 ? absolute maximum ratings ????????????.????????????????????? 6 ? operating supply voltage range ????????.????????? ?????????????? 6 ? allowable current and voltage range ????????????? ???????????????? 7 ? electrical characteristics ?????.????????????????????????????? 8 ? electrical characteristics (reference values for design) ?????????????????????. 9 ? control pin mode table ???? ??????.??????????? ?????????????? 10 ? technical data ????????????????.??????????????????????.. 11 y i/o block circuit diagrams and pin f unction descriptions ? ????????????? ???????. 11 y reference data ??????????????????????????????????????. 13 y p d ? t a diagram ?????????????????????????????????????. 14 ? usage notes ????????????????. ????????????? ??????????. 15 y special attention and precaution in using ?????????? ????????????????? 15 y notes of power lsi ????????????????????????????????????. 16 y notes of this lsi ?????????????????????????????????????. 17
AN41402A 3 ver. aeb AN41402A 2-ch motor drive ic ? overview the AN41402A is a 2-ch motor drive ic. th is ic features a low on resistance an d wide operating supply voltage range. it is possible to shrink the mounting area by adopting the wafer level chip size package. ? features y 2-ch motor drive ic y forward reverse drive is possible y it is possible to drive not only a motor but also an actuator y low on resistance : 0.4 (upper and lower) y operating supply voltage range : 2.7 v to 5.5 v (for control circuit) 2.0 v to 13.8 v (for motor drive) y downsizing by adopting an wafer level chip size package y additional features : built-in standby function thermal shutdown circuit low voltage detection circuit ? applications y shutter, mirror and lens for camera ? package y 19 pin wafer level chip size package (wlcsp) (size : 2.41 mm 1.91 mm, 0.5 mm pitch) ? type y bi - cdmos ic
AN41402A 4 ver. aeb vm12 ? application circuit example (block diagram) mode select thermal shut down osc low voltage detection vdd stby gnd vm11 charge pump bc1 bc2 bc3 bc4 vpump 0.1 f (strength voltage vm + 6 v) 0.01 f (strength voltage vm + 6 v) 0.01 f (strength voltage vm + 6 v) pg1 3.3 v 47 f 7.4 v 47 f dmos h- bridge pre- drive logic in1a in1b fo1 ro1 pre- drive logic in2a in2b fo2 ro2 7.4 v 47 f dmos h- bridge vm22 vm21 pg2 v pump v pump output error detection notes) y this application circuit is an example. the operation of mass production set is not guaranteed. perform enough evaluation and verif ication on the design of mass production set. y this block diagram is for explaining functions. part of the block diagram may be omitted, or it may be simplified.
AN41402A 5 ver. aeb ? pin descriptions ground 2 for motor drive ground pg2 d6 ch.2 non-inverting output output fo2 d5 power supply 2 for ch.2 motor drive power supply vm22 d4 charge pump capacitor connection 1 output bc1 d3 charge pump capacitor connection 3 output bc3 d2 charge pump output output vpump d1 ch.2 inverting output output ro2 c5 power supply 1 for ch.2 motor drive power supply vm21 c4 charge pump capacitor connection 2 output bc2 c3 charge pump capacitor connection 4 output bc4 c2 power supply for control circuit power supply vdd c1 ch.1 non-inverting output output fo1 b5 power supply 2 for ch.1 motor drive power supply vm12 b4 ch.2 inverting input input in2b b3 ch.1 inverting input input in1b b2 total shutdown input input stby b1 ground 1 for motor drive ground pg1 a6 ch.1 inverting output output ro1 a5 power supply 1 for ch.1 motor drive power supply vm11 a4 ch.2 non-inverting input input in2a a3 ch.1 non-inverting input input in1a a2 ground for control circuit ground gnd a1 description type pin name pin no. ? pin configuration (bottom view) 1 a 2345 b c d bc1 vm22 fo2 vdd bc2 vm21 ro2 bc4 stby in2b vm12 fo1 in1b gnd vm11 ro1 in1a 6 pg2 pg1 bc3 vpu mp in2a
AN41402A 6 ver. aeb ? operating supply voltage range 700 i m2 ma ma 1 800 (10 ms) i (p) peak2 ma 1 000 (100 ms) i (p) peak3 ma 3 000 (1 ms) i (p) peak1 notes *5 *5 *4 *5 *3 *3 *2 ? *1 n = a2, a3, b1, b2, b3 v gnd to v dd v (n) control signal input voltage 8 m = a5, b5, c5, d5 v 14.7 v (m) drive output voltage 7 p = a5, b5, c5, d5 ma 700 (dc) i (p) dc drive output current 6 700 i m1 14.0 v m1 , v m2 ? 100 i dd supply current 2 appropriate pin no. unit rating symbol parameter a no. ? c ?55 to +150 t stg storage temperature 5 ? c ?30 to +85 t opr operating ambient temperature 4 ? mw 100 p d power dissipation 3 ? v 6.0 v dd supply voltage 1 13.8 max 7.4 typ 5.5 3.3 2.0 v m1 , v m2 *1 notes unit min symbol parameter v 2.7 v dd supply voltage range ? absolute maximum ratings note) absolute maximum ratings are limit values which do not resu lt in damages to this ic, and ic operation is not guaranteed at t hese limit values. note) *1 : the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. notes) *1: the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. the voltage of the charge pump circuit volta ge will exceed the supply vo ltage. the limit voltage of the charge pump is shown on page 8. v m1 is voltage for vm11 and vm12. v m2 is voltage for vm21 and vm22. *2: the power dissipation shown is the value at t a = 85 c for the independent (unmounted) ic package without a heat sink. when using this ic, refer to the ? p d -t a diagram in the ? technical data and design the heat radiati on with sufficient ma rgin so that the allowable value might not be exceeded based on the conditi ons of power supply voltage, load, and ambient temperature. *3: except for the power dissipation, operating ambient temp erature, and storage temperature, all ratings are for t a = 25 c. *4: design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the time conditi ons which the drive output current 3 000 ma is allowed within 1 ms and 1 800 ma is allowed within 10 ms and 1 000 ma is allowed within 100 ms. however, the output frequency f requires that f 5 hz. *5: do not apply voltage or current from outside to these pin. the setting not exceeding the rating, even transiently, is required . for the circuit currents, '+' denotes current flowing into the ic, and ' ? ' denotes current flowing out of the ic.
AN41402A 7 ver. aeb *1 v gnd to 18.5 vpump d1 *1 v gnd to v m2 bc3 d2 *1 v gnd to v m2 bc1 d3 *1 v gnd to 19.5 bc2 c3 *1 v ? 1.0 to 14.7 ro2 c5 *1 v ? 1.0 to 14.7 fo2 d5 *1 v gnd to 19.5 bc4 c2 *1 v ? 1.0 to 14.7 fo1 b5 ? v gnd to v dd in2b b3 ? v gnd to v dd in1b b2 ? v gnd to v dd stby b1 ? v gnd to v dd in2a a3 gnd to v dd in1a notes unit rating pin name pin no. *1 v ? 1.0 to 14.7 ro1 a5 ? v a2 ? allowable current and voltage range notes) y allowable current and voltage ranges are limit ranges which do no t result in damages to this ic, and ic operation is not guaran teed within these limit ranges. y voltage values, unless otherwise specified, are with respect to gnd. gnd is voltage for gnd, pg1 and pg2. gnd = pg1 = pg2. y v dd is voltage for vdd. y v m2 is voltage for vm21 and vm22. v m2 = vm21 = vm22. y do not apply external currents or voltages to any pin not specifically mentioned. note) *1 : do not apply external voltage to this pin. the se tting not exceeding the rating, ev en transiently, is required.
AN41402A 8 ver. aeb ? s 0.2 0.1 ? ? t f fall time 15 ? s 1.0 0.4 ? ? t plh turn on time 16 ? s 0.5 0.2 ? ? t phl turn off time 17 ? a 33 16.5 8.3 in1a = in1b = 3.3 v in2a = in2b = 3.3 v i inh in1a, in1b, in2a, in2b high-level input current 11 ? a ? ? ?1.0 ? i inl in1a, in1b, in2a, in2b low-level input current 12 ? 0.5 0.4 ? i vm1 ,i vm2 = 500 ma r on output on resistance (upper and lower) 13 ? s 0.2 0.1 ? ? t r rise time 14 ? v 13.4 11.4 10.4 i pump = ?500 a v pumpl charge pump current capability 8 *1 v 0.5 ? ? ? v sbl stby low-level input voltage 5 ? v 13.4 12.4 11.4 i pump = 0 a v pump charge pump voltage 7 *1 v 0.5 ? ? ? v inl in1a, in1b, in2a, in2b low-level input voltage 10 *1 v ? ? 2.2 ? v inh in1a, in1b, in2a, in2b high-level input voltage 9 driver block common block supply current ? ? ? ma 2.2 1.7 ? in1a = in1b = low in2a = in2b = low i dda control power supply current under no input 3 a 100 ? ? stby = low i vm drive power supply current in standby mode 1 a 10 ? ? stby = low i dds control power supply current in standby mode 2 standby operation ? k 300 200 100 ? r stby stby pull-down resistance 6 *1 v D ? 2.2 ? v sbh stby high-level input voltage 4 charge pump circuit limits typ unit max notes min conditions symbol parameter b no. note *1 :refer to page 10 for the mode setting. ? electrical characteristics at v dd = 3.3 v, v m1 = v m2 = 7.4 v, stby = 3.3 v note) t a = 25 c 2 c unless otherwise specified.
AN41402A 9 ver. aeb ? v ? 0.2 ? ? v lvd hysteresis width ? v ? 2.4 ? ? v lvd operation voltage of low voltage detection operation of low voltage detection 19 20 ? khz 300 ? ? ? f max input signal frequency 18 ? c ? 35 ? ? t tsd thermal shutdown hysteresis temperature 22 ? c ? 160 ? ? t tsd thermal shutdown operating temperature 21 thermal shutdown reference values typ unit max notes min conditions symbol parameter b no. ? electrical characteristics (reference values for design) at v dd = 3.3 v, v m1 = v m2 = 7.4 v, stby = 3.3 v notes) t a = 25 c 2 c unless otherwise specified. the characteristics listed below are reference values derived fr om the design of the ic and are not guaranteed by inspection. if a problem does occur related to these characteris tics, we will respond in good faith to user concerns.
AN41402A 10 ver. aeb ? control pin mode table hi-z hi-z mute active charge pump circuit 160 c 2.4 v low ? low low high low low high output state input logic ? < 160 c temp. ? > 2.4 v > 2.4 v vdd high stby standby thermal shutdown brake low low ? reverse rotation high low low voltage detection mute hi-z hi-z normal rotation low high ro1 high high mode fo1 in1b in1a hi-z hi-z mute active charge pump circuit 160 c 2.4 v low ? low low high low low high output state input logic ? < 160 c temp. ? > 2.4 v > 2.4 v vdd high stby standby thermal shutdown brake low low ? reverse rotation high low low voltage detection mute hi-z hi-z normal rotation low high ro2 high high mode fo2 in2b in2a y ch.1 motor drive y c h.2 motor drive
AN41402A 11 ver. aeb power supply vdd for control circuit ? dc (typ. 3.3 v) c1 total shutdown input 200 k ? b1 b5 : ch.1 non-inverting output a5 : ch.1 inverting output d5 : ch.2 non-inverting output c5 : ch.2 inverting output ? ? a5, b5, c5, d5 a2 : ch.1 non-inverting input b2 : ch.1 inverting input a3 : ch.2 non-inverting input b3 : ch.2 inverting input 200 k ? a2, a3, b2, b3 a4 : power supply 1 for ch.1 motor drive b4 : power supply 2 for ch.1 motor drive ? dc (typ. 7.4 v) a4, b4 a1 : ground for control circuit a6 : ground 1 for motor drive d6 : ground 2 for motor drive ? dc 0 v a1, a6, d6 impedance description internal circuit waveform and voltage pin no. a1 a6 d6 c1 142k 58k pina2 a3 b2 b3 a4 b4 v m (7.4 v) pinb5 d5 pina5 c5 b1 152k 48k ? technical data y i/o block circuit diagrams and pin function descriptions note) the characteristics listed below are reference values derived from the design of the ic and are not guaranteed.
AN41402A 12 ver. aeb charge pump capacitor connection 1 ? ? d3 charge pump capacitor connection 3 ? ? d2 charge pump output ? dc about 12.4 v d1 c4 : power supply 1 for ch.2 motor drive d4 : power supply 2 for ch.2 motor drive ? dc (typ. 7.4 v) c4, d4 charge pump capacitor connection 2 ? ? c3 charge pump capacitor connection 4 ? ? c2 impedance description internal circuit waveform and voltage pin no. 25k c2 5k 10 25k c3 5k 10 c4 d4 20 d1 25k 5k v m (7.4 v) 300k 20 d2 v m (7.4 v) 20 d3 v m (7.4 v) ? technical data (continued) y i/o block circuit diagrams and pin function descriptions (continued) note) the characteristics listed below are reference values derived from the design of the ic and are not guaranteed.
AN41402A 13 ver. aeb -30 -20 -10 0 10 20 30 40 50 1.522.533.54 vm[v] ron[%] -40 -30 -20 -10 0 10 20 30 40 2.533.544.55 vdd[v] ron[%] ?30 c 25 c 85 c ?30 c 25 c 85 c ron change rate ? v dd characteristics ron change rate ? v m characteristics ? technical data (continued) y reference data note) the characteristics listed below are reference values derived from the design of the ic and are not guaranteed. ron change rate [%] vdd [v] ron change rate [%] vm [v]
AN41402A 14 ver. aeb ? technical data (continued) y p d ? t a diagram
AN41402A 15 ver. aeb y special attention and precaution in using 1. this ic is intended to be used for general elec tronic equipment [shutter, mirror and lens for camera]. consult our sales staff in advance for in formation on the foll owing applications: x special applications in which ex ceptional quality and reli ability are required, or if the fail ure or malfunction of this ic may directly jeopardize life or harm the human body. x any applications other than the standard applications intended. (1) space appliance (such as artificial satellite, and rocket) (2) traffic control equipment (such as fo r automobile, airplane, train, and ship) (3) medical equipment for life support (4) submarine transponder (5) control equipment for power plant (6) disaster prevention and security device (7) weapon (8) others : applications of which reliability equivalent to (1) to (7) is required it is to be understood that our company shall not be held respons ible for any damage incurred as a result of or in connection w ith your using the ic described in this book for any special applicatio n, unless our company agrees to your using the ic in this bo ok for any special application. 2. pay attention to the direction of lsi. when mounting it in the wrong direction onto the pcb (printed-circuit-board), it might smoke or ignite. 3. pay attention in the pcb (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. in addition, refer to the pin description for the pin configuration. 4. perform a visual inspection on the pcb be fore applying power, otherwise damage might happen due to problems such as a solder- bridge between the pins of the semiconductor device. also, perfo rm a full technical verification on the assembly quality, becau se the same damage possibly can happen due to conductive substanc es, such as solder ball, that adhere to the lsi during transportation. 5. take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin- v cc short (power supply fault), output pin-gnd short (ground fault), or output-to-output-pin short (load short) . and, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage a nd operating environment etc.). esp ecially, please be careful not to exceed the range of absolu te maximum rating on the transient state, such as power-on, power-off and mode -switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, ta ke into the consideration of incidence of break down and failur e mode, possible to occur to semiconductor produc ts. measures on the system s such as redundant design, arresting the spread of fi re or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the produ cts. 7. when using the lsi for new models, verify the safe ty including the long-term reliability for each product. 8. when the application system is designed by using this lsi, be sure to confirm notes in this book. be sure to read the notes to descriptions and the usage notes in the book. 9. due to unshielded structure of this ic, under exposure of li ght, function and characteristic of the product cannot be guarante ed. during normal operation or even under testing condition, please ensure that ic is not exposed to light. 10. basically, chip surface is ground potential. please design to ensure no contact between chip surface and metal shielding. ? usage notes
AN41402A 16 ver. aeb ? usage notes (continued) y notes of power lsi 1. the protection circuit is for maintain ing safety against abnormal operation. ther efore, the protection circuit should not wo rk during normal operation. especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is momentarily exce eded due to output pin to v cc short (power supply fault), or output pin to gnd shor t (ground fault), the lsi might be damaged before the thermal protection circuit could operate. 2. unless specified in the product specifications, make sure that negative voltage or excessive vo ltage are not applied to the p ins because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the on and off timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven. 3. the product which has specified aso (area of safe operation) should be operated in aso. 4. verify the risks which mi ght be caused by the malfunctions of external components.
AN41402A 17 ver. aeb xxxx via xxxx wiring wiring pattern example d c b a bc1 vm22 fo2 vdd bc2 vm21 ro2 bc4 stby in2b vm12 fo1 in1b gnd vm11 ro1 in1a pg2 bc3 vpu mp in2a ic (top view) pg1 12345 6 bc3 ? usage notes (continued) y notes of this lsi 1. make sure to power on, off, and sw itching under the standby mode (stby = low). 2. apply voltage from a low-impedance source to vdd and vm. connect a bypass capacitor to each as near the ic as possible. 3. in case of that the output is changed into hi-z (in1a = in1b = low, in 2a = in2b = low) in the rotation of motor, due to the motor current to flow back into a power source, the supply voltage might rise. 4. if the error detection circuit is active, all outputs are fixed in hi-z during the specified time (470 s 30%). the function is for safety improvements and is not guaranteed nondestructive control. 5. check the characteristics carefully before using this ic. preserve sufficient margin in consideration of dispersion of external components and our ics including not only static characteristics but transition characteristics when using this ic changing external circuit constants. 6. prohibit mounting with solder dippin g and mounting to a flexible cable. 7. the heat thermal resistance is variable due to the mounted status of this ic. to reduce the heat thermal resistance, it is recommended that the power supply and gnd pins are conne cted to a wide metal la yer as short as possible. refer to the following figure shown an example of a wiring pattern. the heat thermal resistance value (for simulation) in case of the following wiring pattern example rth(j-a) = 88 c/ w condition : glass-epoxy pwb, 50 50 0.8t (mm), 4-ply
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202

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